Project: Standard for Digital Data Format for Nuclear Instrumentation
Performance requirements in the electronics industry can no longer be met by downsizing conventional semiconductor devices. More compact 3D microchips (also known as 3D integrated circuits) are being developed to meet requirements, offering reduced power consumption and increased speed over their 2D counterparts. 3D integration technology uses a type of electrical connection, known as a through-silicon vias (TSVs), to vertically stack chips and produce 3D integrated circuits with an optimum balance between cost, functionality, performance and power consumption. While this technology is already used in applications such as imager sensors and memory, its extension into new areas will require a greater density of smaller TSVs with higher aspect ratios. This project will develop traceable measurement capabilities for detecting structural and chemical defects in high aspect ratio TSVs, and new methods to accurately characterise thermal and electrical properties at the nanoscale. This metrological infrastructure will allow Europe to play a more important role in the supply chain for future information systems built using highly dense electronics, and will create an enduring competitive advantage for Europe.
| Acronym | 14SIP07 Digital Standard (Reference Number: 14SIP07) |
| Duration | 01/06/2015 - 31/05/2018 |
| Project Topic | Metrology |
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Project Results (after finalisation) |
See Website |
| Website | visit project website |
| Network | EMPIR |
| Call | EMPIR CALL 2014 |
Project partner
| Number | Name | Role | Country |
|---|---|---|---|
| 1 | NPL Management Limited | Coordinator | United Kingdom |
| 2 | Commissariat à l'énergie atomique et aux énergies alternatives | Partner | France |
| 3 | Agenzia Nazionale per le nuove tecnologie, l’energia e lo sviluppo economico sostenibile | Partner | Italy |
| 4 | Sateilyturvakeskus | Partner | Finland |
| 5 | JRC - Joint Research Centre - European Commission | Observer | Belgium |