Project: Laser-assisted low-stress Reflow Bonding of optoelectronic Components

We want to investigate a laser assisted reflow bonding process for photonic components aiming for increased accuracy and component density for smaller package sizes to address novel products and new markets. This will be enabled by transmission laser soldering with absorption of laser radiation localized to the bond zone. We will generate process knowledge for automated bonding and an integrated process chain from component to package for economic, high throughput, and high yield manufacturing.

Acronym	LaReBo (Reference Number: 10419)
Duration	01/09/2016 - 01/09/2018
Project Topic	Industrial Manufacturing, Material And Transport
Network	Eurostars 2
Call	Eurostars Cut-Off 5

Project partner

Number	Name	Role	Country
24006	ficonTEC Service GmbH	Coordinator	Germany
24007	Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung e.V.	Partner	Germany
24008	QSI Co., Ltd.	Partner	Korea, Republic of