Project: Hybrid Photonic Integrated Circuit assembly via flexible waveguides
| Acronym | FLEXFIX (Reference Number: 12495) |
| Duration | 01/11/2018 |
| Project Topic | This project will deliver an assembly process for Photonic Integrated Circuits (PIC) which integrates the functionality of Indium Phosphide (InP) and SiN based TriPleX in a cost effective manner. Flexible waveguides on TriPleX and corresponding guiding structures on the InP will be combined with the assembly process and equipment of ficonTEC to result in a self aligning PIC assembly. Schematically shown in a picture in technical annex 2. |
| Network | Eurostars 2 |
| Call | Eurostars Cut–off 9 |
Project partner
| Number | Name | Role | Country |
|---|---|---|---|
| 1 | LioniX International | Coordinator | Netherlands |
| 2 | ficonTEC | Partner | Germany |
| 3 | Technische Universiteit Eindhoven | Partner | Netherlands |