Project: Novel MEMS Microphone Packaging Technology for an Inner Ear Microphone

Acronym	TiSR (Reference Number: 12584)
Duration	01/09/2018
Project Topic	The goal of this project is to deliver the last missing part of a packaging technology developed to realize a long term implantable microphone for a totally implantable cochlear implant (TICI). This titanium part is called the sound receptor (SR) and integrates submicron thick Ti diaphragms, which transfer sound energy from fluid inside the inner ear to the commercially available MEMS condenser microphone, which is protected by the packaging structure and located within the middle ear cavity.
Network	Eurostars 2
Call	Eurostars Cut–off 9

Project partner

Number	Name	Role	Country
1	SwissNeutronics AG	Coordinator	Switzerland
2	Cochlear Technology Centre Belgium	Partner	Belgium
3	Linköping University	Partner	Sweden
4	University of Zurich	Partner	Switzerland